Multi-Die Laser Package

Light is powerful. The new Multi-Die Laser Package for Projectors

Unique 50W optical output power: the new laser module PLPM4 450 from OSRAM Opto Semiconductors greatly simplifies the construction of professional laser projectors. For the first time up to 20 blue laser chips have been packaged into a compact housing. In addition, the optical power of the individual chips has been doubled, thus achieving a total power of 50 watts and enabling projectors over 2,000 lumens of brightness with only one housing.

Advantages

Multi-Die Package will facilitate integration into projectors due to:

Assembly

Reduced assembly time due to handling of less components. Up to 20 laser chips are combined in a single package.

Optical Alignment

Complexity of optical alignment is dramatically reduced: Only a single sheet multi lens array is required for beam collimation.

Form factor

Multi-Die Package is a highly integrated package offering a unique small size.

Features

PLPM4 450: New Brilliant Perspectives for Professional Laser Projector Design:

Butterfly package with 50 W optimal output power at Tcase 65°C
Up to 5 multimode laser chips in series connection bonded on 4 bars
Each bar can be operated individually
Wavelength: 450 nm +/- 10nm
Typ. wall plug efficiency of 35 % at 25° Tcase
ESD protection diode for each laser chip
Operation temperature: 10°C up to 70°C

Products

	Multi-Die Package PLPM4 450
Dimension	25.5 mm x 35 mm (Emitting surface 16 mm x 16.5 mm)
Optical output power	50 W (at 65°C case temperature)
Wavelength	450 nm ± 10nm
Lifetime (L50)	20,000 hours @ Tcase 65°C & 50 W

PLPM4 450: The first multi-die laser package that provides 50W blue light output for professional projectors with more than 2,000 lumens of brightness.

Download Multi-Die Laser Pckage product flyer here!

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Multi-Die Laser Package (192.0 KB)